JPH0229752Y2 - - Google Patents
Info
- Publication number
- JPH0229752Y2 JPH0229752Y2 JP15340385U JP15340385U JPH0229752Y2 JP H0229752 Y2 JPH0229752 Y2 JP H0229752Y2 JP 15340385 U JP15340385 U JP 15340385U JP 15340385 U JP15340385 U JP 15340385U JP H0229752 Y2 JPH0229752 Y2 JP H0229752Y2
- Authority
- JP
- Japan
- Prior art keywords
- piece
- cover
- outer case
- vertical side
- box
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003780 insertion Methods 0.000 claims description 25
- 230000037431 insertion Effects 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000011888 foil Substances 0.000 claims description 6
- 239000000123 paper Substances 0.000 description 16
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 241001122767 Theaceae Species 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15340385U JPH0229752Y2 (en]) | 1985-10-07 | 1985-10-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15340385U JPH0229752Y2 (en]) | 1985-10-07 | 1985-10-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6262494U JPS6262494U (en]) | 1987-04-17 |
| JPH0229752Y2 true JPH0229752Y2 (en]) | 1990-08-09 |
Family
ID=31072250
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15340385U Expired JPH0229752Y2 (en]) | 1985-10-07 | 1985-10-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229752Y2 (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5979672A (en) * | 1996-04-10 | 1999-11-09 | Telcordia Technologies, Inc. | Earthquake resistant enclosure for electronic equipment |
| JP4343541B2 (ja) * | 2003-01-23 | 2009-10-14 | 株式会社ヨコオ | シールドケース |
-
1985
- 1985-10-07 JP JP15340385U patent/JPH0229752Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6262494U (en]) | 1987-04-17 |
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